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GUC – Pioneering Advanced ASIC Solutions for a High-Tech World


Introduction to GUC's ASICs

In a world where technology constantly evolves, staying ahead of the curve is crucial for success. Global Unichip Corporation (GUC), a leading name in the ASIC industry, exemplifies this philosophy. GUC, established in 1998 and headquartered in Taiwan's Hsinchu Science Park, has established itself as a powerhouse in the ASIC service industry, thanks to its innovative approach and robust business models.


GUC’s expertise encompasses an extensive array of design services, including initial ‘spec-in’, comprehensive System-on-Chip (SoC) integration, meticulous physical implementation, and avant-garde packaging technologies. This market leader is recogniSed for its exceptional work in sectors pivotal to the future of technology, such as AI (artificial intelligence), high-performance computing, 5G/networking, and solid-state drive (SSD) technologies. GUC is committed to delivering to its clients the optimal solution in terms of power, performance, and area (PPA), ensuring both quality and yield are at the forefront of their offerings. Their engineering excellence sets their ASIC solutions apart in a highly competitive market.

GUC’s Evolution and Global Presence

GUC's journey began in 1998, with TSMC becoming its largest shareholder in 2003. This close relationship with TSMC empowers GUC to navigate and overcome various design and manufacturing challenges, thereby fostering excellence in every product they create. Introducing GUC as Ineltek's latest franchise line, we are excited to bring their cutting-edge ASIC solutions and their legacy of innovation to our customers.

Advanced Technology and Services

GUC's technological prowess is evident in its comprehensive service offerings, ranging from ASIC design to IP services and production services. They have mastered the art of turning intricate customer requirements into tangible, high-performance products. Their technology leadership is further reinforced by their advanced packaging technologies, such as 2.5D and 3D multi-die packaging, and their cutting-edge high-speed IP integration capabilities.

Market Leadership and Revenue Growth

GUC's success is reflected in its consistent revenue growth, even during challenging times like the pandemic. This growth is a testament to their resilience and innovation, ensuring no impact from capacity constraints. Their sales revenue shows a steady upward trend, highlighting their robust business model and market acceptance.

Innovative IP Solutions

GUC's IP portfolio is a showcase of their innovation. It includes multi-die interLink interfaces (GLink-2.5D and GLink-3D), high-speed interfaces, and a range of DRAM interfaces. Their commitment to providing total solutions, from design to production, sets them apart in the industry.


GUC 2.5D and 3D multi-die advanced packaging plattform

GUC 2.5D and 3D Multi-die Advanced Packaging Technology Platform

Platform Highlights

  • HBM3 PHY + Controller IP

  • Die-to-die IP (GLink-2.5D)

  • Die-on-die IP (GLink-3D)

  • High speed IP integration

  • (112G SerDes, PCIe-5, GDDR6)

  • Advanced Packaging Technology (CoWoS / InFO / 3D-SoIC)


Service Scope

  • SoC and ASIC design to production

  • Interposer and RDL design

  • SI/PI/IR/THM simulation

  • Package and substrate design

Industry-Leading, Production-Proven HBM3 IP Provider

  • World’s first HBM3 IP at 7.2Gpbs is silicon proven in N7

  • N5 HBM3 at 8.4Gbps is silicon proven

  • 6 (N5 x1, N7 x3, N16 x2) product chips with CoWoS using HBM2(E) KGD

The most optimised multi-die interLink (GLink) solution

  • N5 GLink 2.3LL is silicon proven

  • GUC joined UCIe to contribute die-to-die interconnect and APT expertise; the 1st GUC UCIe

  • Competitive power, performance, and form factor for multi-die interconnect using 2.5D (InFO/CoWoS) advanced packaging technology

HBM/GLink total solution

  • Total Service Package, including sub-system built/integration, InFO_RDL/Interposer design,

  • SI/PI/Thermal co-sim, and sub-system bring-up services

Future Directions and Opportunities

Looking ahead, GUC is poised to capitalise on emerging trends in HPC, AI, networking, and automotive sectors. Their advanced node technologies (N5/N3E) are well-suited to meet the PPA requirements of these high-growth areas.

Conclusion

GUC stands as a beacon of innovation and technological excellence in the ASIC industry. Their journey from a humble beginning to becoming an industry leader is inspiring. With their robust business model, advanced technology, and commitment to customer satisfaction, GUC is well-positioned to lead the charge in the high-tech world of ASIC solutions.


For more information on GUC's innovative solutions, how they can benefit your projects and begin your project early evaluation process, contact Ineltek now.


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