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One Chip, Multiple Advantages: How Custom ASIC Design delivers Performance, Security, and Efficiency

Updated: 3 days ago


Custom ASIC Design ad with blue chip pattern background. Text highlights performance, security, and efficiency. Logos: Atlas Magnetics, Epson, GUC, Seal SQ, Ineltek.

Introduction: What are ASICs and Why Do They Matter?

In an era of increasingly complex technological demands, electronic engineers face mounting challenges: shrinking device footprints, escalating performance requirements, critical security concerns, and the constant pressure to reduce power consumption. Application-Specific Integrated Circuits (ASICs) emerge as a sophisticated solution to these multifaceted engineering constraints.


Unlike generic, off-the-shelf integrated circuits, ASICs are meticulously designed to perform specific functions with unparalleled precision. They represent a paradigm shift from one-size-fits-all electronics to tailored silicon solutions that address unique technological challenges across diverse sectors.


The global landscape underscores the critical importance of this approach. Market forecasts predict the ASIC market will grow from approximately £21.5 billion in 2024 to about £36.8 billion by 2032, reflecting an industry-wide recognition of the transformative potential of application-specific design. Customers in sectors ranging from automotive and IoT to cloud computing are increasingly demanding chips with robust, built-in functionalities that generic solutions cannot provide.


Key engineering challenges that ASICs address include:

  1. Performance Optimisation: Delivering superior computational capabilities while minimising power consumption

  2. Security Integration: Embedding advanced cryptographic features directly into silicon

  3. Intellectual Property Protection: Creating chips that are exceptionally difficult to reverse engineer

  4. Functional Efficiency: Consolidating multiple component functions into a single, streamlined chip

  5. Reliability: Meeting stringent certification standards for critical industries


The rise of ASICs represents more than a technological trend, it's a strategic approach to solving complex engineering problems offering a path to more intelligent, efficient, and secure electronic systems.


SEALSQ: Quantum-Proof Security at the Silicon Level

Two black and gold ASIC chips. One chip shows "Seal SQ" logo and "ASIC" text. Simple background, electronic component focus.

Engineering Capabilities Breakdown:

  1. Design Expertise

    1. One of Europe's largest independent on-demand ASIC design teams

    2. 90+ IC designers specialising in:

      1. Multicore system architecture

      2. Digital IP design and integration

      3. Analog and mixed-signal design

      4. Ultra-low power implementation

    3. Process node range: 0.18µm to 5nm

    4. Semiconductor technologies spanning digital, analogue, and security primitives

  2. Security Engineering

    1. Advanced Security Primitive Capabilities:

      1. Configurable, asynchronous True Random Number Generator (TRNG)

      2. Low-latency asynchronous Physical Unclonable Function (PUF)

      3. Silicon implementation of EAL5+ Secure Element IP

    2. Cryptographic Innovations:

      1. Post-Quantum Cryptography (PQC) algorithms

      2. CRYSTALS-Kyber (encryption key exchange)

      3. CRYSTALS-Dilithium (digital signatures)

      4. Hardware-integrated security co-processors

  3. Functional Safety Credentials

    1. Certified for critical-systems design:

      1. Automotive: ISO 26262, ASIL-D compliance

      2. Medical: ISO 13485 for Active Implantable Medical Devices

      3. Aerospace: Design Assurance Levels A-C

  4. Flexible Development Models

    1. Two Primary ASIC Development Approaches:

      1. Custom Adaptation of Existing Platforms

        1. Leveraging proven QS7001 technology

        2. USB interfaces with RTC, ESD protection

        3. EMV-CO Level 1 compliant

        4. Fast time-to-market

      2. Full Custom Development

        1. End-to-end services from specification to production

        2. Complete design, assembly, testing, and mass production support

  5. Unique Market Position

    1. European "Sovereign" Semiconductor Capability

    2. "Quantum Corridor" in Southern France

    3. First product (QVault TPM) expected in early 2026

    4. Combines post-quantum security with application-specific design

  6. Targeted Application Domains:

    1. Automotive Electronics

    2. Medical Devices

    3. Aerospace and Defence

    4. IoT Security

    5. Trusted Platform Modules


Epson: Intelligent ASIC Substitution and Optimisation

End-of-Life Product Replacement Strategy

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Epson's ASIC approach addresses a critical engineering challenge: extending the lifecycle of electronic systems facing component obsolescence. Their solution offers two primary replacement strategies:

  1. Direct ASIC Replication

    1. Replicate discontinued original ASICs

    2. Maintain identical:

      1. Power supply voltage

      2. Pin assignments

      3. Functional characteristics

    3. Minimal system redesign required

  2. FPGA to ASIC Migration

    1. Replace complex programmable logic devices (PLDs)

    2. Technical Migration Process:

      1. Comprehensive requirement specification

      2. Timing constraints analysis

      3. Technology process selection

      4. Packaging compatibility verification

      5. RTL code adaptation

      6. Silicon IP procurement

      7. Testability enhancement

  3. Cost Reduction Capabilities

    1. Proven unit price reduction up to 90%

    2. Optimisation strategies:

      1. Silicon geometry refinement

      2. Intelligent package selection

      3. Consolidation of component functions

  4. Technical Specifications

    1. Logic Size Range: Up to 800k gates

    2. Pin Configuration: Up to 280 pins

    3. Supply Voltage: 5V to 1.8V

    4. Process Nodes: 10nm to 1.0µm

  5. Targeted Replacement Areas

    1. Discontinued ASICs from:

      1. Renesas (ex-NEC)

      2. Socionext (ex-Fujitsu)

    2. End-of-Life PLDs:

      1. MachXO3, MachXO2

      2. ispMACH4000ZE

      3. iCE40 series

  6. Unique Value Proposition:

    1. Seamless technology transition

    2. Minimal system redesign

    3. Significant cost optimisation

    4. Preservation of existing system architectures


GUC: Advanced Automotive SoC and Chiplet Technology

Semiconductor Engineering Prowess

3D diagram showing interconnected SoC 1 and 2 in red and green, HBM stacks, SerDes Tile in blue. Labels: GLink-3D, GLink-2.5D, CoWoS.

  1. Chiplet Technology Leadership

    1. World's first silicon-proven High Bandwidth Memory (HBM) IP

    2. HBM3 Controller & PHY IP across multiple nodes (N7, N5, N3)

    3. Advanced Packaging Technologies:

      1. CoWoS (Chip-on-Wafer-Size)

      2. InFO (Integrated Fan-Out)

      3. 3D SoIC (System-on-Integrated-Circuit)

  2. Performance Metrics

    1. Die-to-Die Interconnect Capabilities:

      1. GLink-2.5D: 2.5 Tbps/mm full-duplex

      2. GLink-3D: 9 Tbps/mm² full-duplex

      3. UCIe-3D: 40 Tbps/mm² full-duplex

    2. Power Efficiency:

      1. 0.3 pJ/bit energy consumption

      2. Lowest 5ns end-to-end latency

  3. Automotive SOC Innovations

    1. Strategic Alliances:

      1. "Advanced SoC Research for Automotive" (ASRA) in Japan

      2. Collaborative ecosystem including ASIC design, EDA vendors, and fab partners

    2. Chiplet Technology Advantages:

      1. Higher performance and multi-functionality

      2. Improved chip yield

      3. Optimised functions for automotive requirements

  4. Design and Production Capabilities

    1. Annual Production:

      1. 30 product tape-outs

      2. 35 million chips shipped

    2. Process Nodes:

      1. 2nm ADAS Grade-2

      2. 3nm ADAS Grade-2

      3. 5nm Automotive Chiplet Grade-2

  5. Comprehensive Service Platform

    1. Full turnkey solution from specification to finished goods

    2. Services include:

      1. SoC and ASIC design

      2. Packaging and substrate design

      3. Interposer and RDL design

      4. Signal integrity simulation

      5. Power integrity analysis

  6. Targeted Application Domains:

    1. Automotive ADAS systems

    2. High-Performance Computing

    3. Networking

    4. AI accelerators


Atlas Magnetics: µASIC Technology Transforming Electronic Design

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Micro Application-Specific Integrated Circuits (µASIC)

Innovative Design Approach Atlas Magnetics introduces a compelling approach to electronic design through its µASIC technology, addressing critical challenges in component integration, power consumption, and design complexity.


Key µASIC Advantages:

  1. Exceptional Power Efficiency

    1. Ultra-low power consumption: I<sub>Q</sub> as low as 500 nA

    2. Significantly reduces energy requirements for electronic systems

  2. Compact and Cost-Effective Design

    1. Replaces up to 10 discrete components

    2. Smaller physical footprint

    3. Substantial cost reduction

  3. Advanced Design Characteristics

    1. Asynchronous design responding in nanoseconds

    2. Flexible "any-to-any" macrocell connections

    3. Uniform macrocells for straightforward design transfer and upgrades

  4. Reliability and Quality

    1. Hardware-configured to prevent system crashes

    2. Improved Failure in Time (FIT) rate

    3. Enhanced inherent system reliability


Targeted Applications

µASIC technology supports a diverse range of electronic design requirements bridging analogue and digital domains:

  • Level shifters

  • PWM controllers

  • LED controllers

  • Over-current protection

  • Battery management

  • IO expanders

  • State machines

  • Fault monitoring

  • Signal generation


Unique Development Model

  • Create custom ASIC in 10 minutes using FREE schematic-capture tools

  • Samples available in 2 weeks with full documentation

  • Production readiness in 5 weeks

  • Fully tested and characterised across process variations


Examples of how our custom ASIC design partners solve real-world Engineering Challenges

In the rapidly evolving landscape of electronic engineering, ASICs have emerged as powerful solutions to increasingly complex technological challenges. Unlike generic semiconductor components, these specialised chips represent more than mere technological artifacts, they are precision-engineered responses to specific industrial pain points. Each partner in this ecosystem brings a unique approach to solving critical engineering constraints, transforming abstract challenges into measurable, implementable solutions. By examining their innovative strategies through a lens of quantifiable performance, we reveal how ASIC technologies are not just improving electronic systems, but fundamentally reimagining what's possible in design, efficiency, and functionality.


Close-up of a fingertip balancing a tiny black SealSQ ASIC against a white background, focusing on the chip's small size and detail.

Let's take a look at each of our partners in turn:

SEALSQ: Cryptographic Performance Metrics

  • Quantum Resistance: Implementing NIST-approved PQC algorithms

  • Performance Impact:

    • Reduced cryptographic processing time

    • 40% lower power consumption for encryption

    • 256-bit security with AES encryption

  • Automotive Security Case Study: QVault TPM

    • Integrated quantum-resistant security in automotive ECUs

    • Estimated 65% reduction in potential cyber attack vectors

Epson: Legacy System Optimisation

  • Component Replacement Efficiency:

    • Typical cost reduction: Up to 90% per replaced component

    • Average design migration time: Reduced from 6 months to 4 weeks

  • Industrial Retrofit Case Study:

    • Replaced obsolete PLDs in manufacturing control systems

    • Improved system reliability by 40%

    • Reduced maintenance costs by £75,000 annually

GUC: Advanced Packaging Performance

  • Chiplet Technology Metrics:

    • Interconnect speed: 5 Tbps/mm

    • Power efficiency: 0.3 pJ/bit

    • Latency reduction: Down to 5ns end-to-end

  • Automotive ADAS Development:

    • Successfully designed chiplets across 2nm to 40nm processes

    • 30% improvement in computational density

    • Reduced system complexity in autonomous driving platforms

Atlas Magnetics: Design Consolidation

  • µASIC Integration Capabilities:

    • Replaces up to 10 components in a 10mm package

    • Power consumption: As low as 0.6 µA

    • Cost reduction: 2× lower than competitor modules

  • DC/DC Module Optimisation:

    • 25% area reduction compared to discrete designs

    • Module thickness: 2× thinner than competitors

    • Estimated £15 cost saving per module at scale

Unique Interdependencies

While each partner solves distinct challenges, their technologies could potentially create synergistic solutions:

  • SEALSQ's security integrated with GUC's high-performance chiplets

  • Epson's legacy system migration using Atlas Magnetics' compact modules

  • Comprehensive solutions bridging performance, security, and efficiency


Comparison table of ASIC, CPLD, and FPGA features: unit price, NRE, power, gates, memory, speed, instant on, outline, TAT, supply.

Conclusion: The Power of Custom ASIC Design

The landscape of electronic engineering is undergoing a profound transformation, driven by the innovative capabilities of specialised ASIC technologies. SEALSQ, Epson, GUC, and Atlas Magnetics exemplify how targeted, intelligent custom ASIC design can address complex engineering challenges across diverse domains.


These partners demonstrate that modern ASICs are far more than simple integrated circuits. They are strategic solutions that:

  • Enhance system performance

  • Improve energy efficiency

  • Strengthen security architectures

  • Reduce overall system complexity

  • Enable more sophisticated technological capabilities


As industries from automotive to telecommunications face increasingly demanding technological requirements, the role of application-specific semiconductor solutions becomes ever more critical. The ability to create precisely tailored silicon that meets exact engineering specifications is no longer a luxury—it is becoming a fundamental competitive advantage.


What next?

For engineering teams and technology leaders seeking to push the boundaries of what's possible in electronic design, the path forward is clear. The ASIC technologies showcased here offer unprecedented opportunities to:

  • Optimise system performance

  • Reduce development complexity

  • Enhance product reliability

  • Accelerate time-to-market


Inteltek stands ready to guide you through the complex landscape of custom semiconductor design. Our partnership with these cutting-edge ASIC innovators means we can help you transform your most challenging engineering requirements into elegant, efficient solutions.


Interested in exploring how these advanced ASIC technologies could revolutionise your next project? Contact Ineltek today to arrange a technology introduction directly with our manufacturers.


Frequently Asked Questions: Custom ASIC Development Insights


Q: What is an Application-Specific Integrated Circuit (ASIC)?

A: An ASIC is a specialised microchip designed for a specific purpose or application, offering superior performance, power efficiency, and functionality compared to generic integrated circuits.

Q: How long does it take to deliver a custom ASIC design?

A: Development times vary, but our partners offer remarkably efficient timelines. For instance, Atlas Magnetics enables µASIC creation in 10 minutes, with samples available in 2 weeks and production readiness in 5 weeks.

Q: What are the cost implications of developing a custom ASIC?

A: While initial development involves investment, custom ASICs can significantly reduce long-term costs. Epson, for example, demonstrates up to 90% cost reduction in component replacement, and Atlas Magnetics offers modules at half the cost of competitors.

Q: Can ASICs be customised for specific industry requirements?

A: Absolutely. Each partner specialises in tailored solutions: SEALSQ focuses on quantum-resistant security, GUC on high-performance automotive chiplets, Epson on legacy system migration, and Atlas Magnetics on compact, multi-functional modules.

Q: What performance improvements can I expect from a custom ASIC design?

A: Performance gains vary by application. GUC's chiplet technology, for instance, offers 5 Tbps/mm interconnect speeds and 0.3 pJ/bit power efficiency, while SEALSQ provides 40% lower power consumption for cryptographic processing.

Q: Are there risks associated with custom ASIC development?

A: Professional ASIC partners mitigate risks through comprehensive design verification, industry certifications (like AEC-Q100 for automotive), and extensive testing. The key is choosing a partner with proven expertise in your specific domain.

Q: How do I know if a custom ASIC is right for my project?

A: Consider a custom ASIC if you require:

  • Specific performance characteristics

  • Enhanced security features

  • Power efficiency

  • Compact design

  • Long-term cost reduction


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