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Bruckewell

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Brückewell supports custom integration and advanced packaging requirements with KGW and wafer-level products, enabling flexible die-level design for SiP, MCM, and other space-constrained applications. These bare die offerings are ideal for engineers needing precise form factor control, custom assembly flows, or early-stage prototyping options.

Product Range

Bare Die

KGW & Wafer

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Tech Docs

To view technical docs or find out more about

Bruckewell

E Ink Ripple Waveform and Spectra 6: Breakthrough in Ultra-Low Power Colour ePaper Displays

To find out more...

E Ink Ripple Waveform and Spectra 6: Breakthrough in Ultra-Low Power Colour ePaper Displays

Advantech AIMB-523: Ryzen-Powered Motherboard for Edge Computing & Industrial AI

To find out more...

Advantech AIMB-523: Ryzen-Powered Motherboard for Edge Computing & Industrial AI
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