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Bruckewell

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Brückewell supports custom integration and advanced packaging requirements with KGW and wafer-level products, enabling flexible die-level design for SiP, MCM, and other space-constrained applications. These bare die offerings are ideal for engineers needing precise form factor control, custom assembly flows, or early-stage prototyping options.

Product Range

Bare Die

KGW & Wafer

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Tech Docs

To view technical docs or find out more about

Bruckewell

SIM7070G-HP-S NTN Module for Satellite and Cellular IoT Connectivity

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SIM7070G-HP-S NTN Module for Satellite and Cellular IoT Connectivity

Automotive‑Grade Battery Monitoring IC For Industrial ESS And UPS: Nuvoton KA849xx BMIC With EIS SOH Estimation

To find out more...

Automotive‑Grade Battery Monitoring IC For Industrial ESS And UPS: Nuvoton KA849xx BMIC With EIS SOH Estimation
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