Meet Epson at Embedded World Nuremberg: Advanced Sensing, Connectivity and Control for the Intelligent Edge

Introduction – Why Epson Matters for Embedded Systems in 2026

The transition to intelligent edge computing demands more than raw processing power. Modern embedded systems must sense, interpret, synchronise, and communicate with unprecedented precision whilst operating on minimal power budgets. Traditional component selections—mismatched sensor noise floors, inflexible wireless stacks, inflexible display interfaces—force engineers into costly compromises between accuracy, power efficiency, and system complexity.

Epson addresses this challenge through integrated embedded solutions rather than point products. For over three decades, the company has invested in proprietary microfabrication technologies (particularly QMEMS—quartz microelectromechanical systems) that deliver measurement precision normally reserved for laboratory instruments, but packaged for industrial edge deployment.

At Embedded World 2026, Epson will showcase five critical technology pillars that solve real engineering problems: ultra-low noise motion sensing, wireless IoT connectivity, display control architecture, precision timing, and voice guidance—each production-proven across demanding applications from structural health monitoring to autonomous robotics.

This teaser introduces what you'll encounter on the stand and why Epson's approach matters for your next-generation embedded design.

The Core Challenge – Precision at the Edge

Edge devices face competing pressures:

Measurement precision: Sensors must resolve subtle motion, vibration, or environmental signals without amplifying noise. A seismic accelerometer detecting microtremor, or an industrial vibration sensor predicting bearing failure, cannot afford noise floors that mask the signal they're trying to measure.

Power efficiency: Battery operation demands sub-100 milliwatt operation for weeks or months between charging. Yet many precision sensors consume watts.

System integration: Engineers waste design cycles interfacing incompatible components—scaling accelerometer signals, converting display protocols, synchronising timing across distributed sensors.

Long-term stability: Deployed systems operate for years. Sensor drift, frequency aging, and thermal instability can render data unusable without expensive recalibration.

Epson's approach addresses all four through coordinated technology choices rather than component-by-component optimisation.

Epson's Foundation – QMEMS Technology and Embedded Systems Integration

Epson's competitive advantage rests on QMEMS (quartz microelectromechanical systems) microfabrication, a proprietary technology delivering motion sensing with noise floors and stability characteristics previously achievable only in laboratory settings.

Why Quartz, Not Silicon?

Quartz resonators exhibit superior temperature stability and lower long-term drift compared to silicon MEMS. Whilst silicon dominates cost-sensitive applications, quartz-based motion sensing delivers:

• Ultra-low noise density: Down to 0.02 µG/√Hz for accelerometers (M-A370), 0.03°/√h for gyroscopes (M-G370)

• Exceptional bias stability: ±0.5 mG repeatability over years, enabling permanent infrastructure monitoring without recalibration

• Temperature-stable operation: Devices maintain performance across -40°C to +85°C industrial ranges

• Proven MTTF: 87,600+ hour operational lifetimes supporting decade-scale deployments

Beyond Motion Sensing

Epson's expertise extends beyond accelerometers and gyroscopes. The same precision-fabrication mindset informs:

• Display controllers maintaining image fidelity across resolution conversions

• Timing devices synchronising distributed sensor networks with nanosecond precision

• Voice guidance ICs enabling natural human-machine interaction

• Wireless modules integrating radio front-ends with embedded processors for seamless IoT integration

Discover Epson's Newest Products at Embedded World

1. Ultra-Low Noise Motion Sensing (M-A370 Accelerometer & M-G370 IMU)

New at 2026: Epson highlights the recently mass-produced M-A370 ultra-low noise accelerometer and complementary M-G370 IMU (Inertial Measurement Unit), representing a generational leap in embedded motion sensing.

M-A370 Accelerometer – Seismic-Grade Precision in Compact Form

The M-A370 delivers what were previously laboratory specifications in a 48×24×16 mm rugged module:

Key Specifications:

• Noise density: 0.02 µG/√Hz (1–10 Hz bandwidth)—enabling detection of subtle vibrations invisible to conventional sensors

• Bias stability: ±0.5 mG temperature error, ±0.1 mG annual repeatability—supporting years of continuous monitoring without recalibration

• Dynamic range: ±10 G with amplitude response flat to ±0.4 dB

• Output: Digital SPI/UART, eliminating analogue noise injection

• GNSS synchronisation: 1PPS input enabling multi-sensor temporal alignment across networked systems

• Operating life: 87,600 hours (10 years) at rated conditions

Why This Matters:

Engineers deploying structural health monitoring (bridges, buildings, tunnels), seismic observation networks, or machinery vibration analysis can now achieve measurement precision without laboratory-grade equipment or recurring calibration expense. The compact form factor integrates into smart meter networks, autonomous vehicle chassis monitoring, or industrial IoT gateways where space is constrained. Read our deep-dive into the new Epson M-A370 Accelerometer here.

M-G370 IMU – Navigation-Grade Gyroscope & Accelerometer in One

The complementary M-G370 IMU combines precision gyroscope with matched accelerometer for full six-degree-of-freedom inertial measurement:

Key Specifications:

• Gyro bias instability: 0.8°/h (compared to 3–5°/h for conventional industrial gyros)

• Angular random walk: 0.06°/√h—enabling precise attitude determination with minimal drift

• Accelerometer range: ±8 G or ±16 G (software-switchable)

• Output rate: Up to 2000 Hz—sufficient for real-time control of stabilisation systems

• Power consumption: ~53 mW typical—enabling battery-powered wearables, drones, and mobile robotics

• Interface: SPI/UART digital output

Why This Matters:

Autonomous systems (drones, UGVs, mobile robots) require gyroscope precision that doesn't accumulate unbounded drift. The M-G370's low bias instability enables dead-reckoning (inertial navigation without external position updates) over timescales measured in minutes rather than seconds. For wearable devices, the low power consumption permits full-day operation on coin-cell batteries whilst maintaining gesture recognition, fall detection, or orientation tracking.

You can read our breakdown of the full Motion Sensor Module range here.

2. Wireless IoT Connectivity – Seamless Edge Communication

Epson's wireless portfolio addresses the fragmentation plaguing IoT deployments: incompatible protocols, inflexible frequency allocations, and integration challenges between radio and embedded processor.

Product Focus at Embedded World:

Epson offers integrated wireless modules combining RF front-end, baseband processor, and application processor in single packages, eliminating the custom integration burden of discrete components.

Key Wireless Solution Categories:

Sub-GHz and 2.4 GHz Solutions

• Low-power mesh networking (Zigbee, Thread, proprietary)

• Long-range, low-data-rate options for battery-powered sensors

• Channel hopping and frequency agility for industrial environments with RF interference

Integration with Motion Sensing

• Combined accelerometer/gyroscope + wireless transceiver enabling condition monitoring nodes that detect vibration anomalies locally, then transmit alerts—reducing network traffic and cloud processing burden

• Example: Wireless vibration sensor continuously monitors bearing temperature and vibration signature; transmits only when predictive maintenance thresholds are exceeded

GNSS Integration

• Precision timing alignment across geographically distributed sensor networks

• Critical for infrastructure monitoring where local vibration events must be time-correlated with regional seismic activity

3. Display Controllers – Bridging Legacy Systems and Modern Interfaces

Industrial and automotive systems often face display architecture challenges: upgrading to higher-resolution outputs without redesigning entire camera or video subsystems, converting between incompatible interface standards (LVDS to HDMI, proprietary timing formats to MIPI).

Epson Display Solutions at Embedded World:

ToraFugu Scaler IC (S2D13V52)

• Flexible resolution scaling (e.g., converting 720p camera input to 1080p display output without quality loss)

• Colour space conversion and gamma correction

• Real-time performance—zero-latency upscaling for live camera feeds

• Automotive-grade reliability with extended temperature operation

GoldenGate Bridge IC (S2D13V70)

• Interface protocol conversion (LVDS ↔ HDMI, parallel RGB ↔ MIPI)

• Timing format adaptation enabling legacy display panels to work with modern SoCs

• Low latency, deterministic operation for time-sensitive applications (vehicle safety systems, industrial monitoring)

Why This Matters for Engineers:

Display integration often consumes disproportionate design cycles. An existing industrial camera subsystem with LVDS timing cannot directly connect to a modern automotive SoC with MIPI CSI support. Rather than redesigning the entire camera pipeline, a single GoldenGate bridge IC performs real-time protocol translation, preserving capital investment in existing hardware and accelerating time-to-market. Read more about Epson's Display Controllers here.

4. Precision Timing Devices – Synchronising Distributed Systems

Edge computing increasingly means distributed intelligence—multiple processors, sensors, and wireless nodes collaborating across a facility, vehicle, or smart infrastructure network. Synchronisation accuracy determines system reliability.

Epson Timing Solutions:

Crystal Oscillators and Real-Time Clocks

• Ultra-stable frequency sources (parts per billion aging rates)

• Temperature-compensated oscillators (TCXO) for outdoor and industrial environments

• GNSS-disciplined timing enabling nanosecond synchronisation across continents

Application Examples:

• Smart Grids: Multiple substations must synchronise power measurements to microsecond precision for fault detection and load balancing

• Autonomous Vehicles: LiDAR, camera, and radar fusion requires timing alignment to sub-microsecond accuracy—clock instability directly impacts object detection reliability

• Structural Health Monitoring: Accelerometers deployed on different floors of a building must timestamp events with microsecond precision to calculate vibration propagation velocity

5. Voice Guidance and Audio ICs – Natural Human-Machine Interaction

As embedded systems become more autonomous, natural voice interaction replaces keypad-based control. Epson's voice guidance ICs combine speech synthesis, noise cancellation, and audio amplification in low-power modules.

Voice Guidance ICs at Embedded World:

Text-to-Speech Synthesis

• Pre-recorded phoneme libraries enabling arbitrary phrase generation

• Multiple languages and accents

• Real-time processing at <100 mW power consumption

Ambient Noise Cancellation

• Dual-microphone input with adaptive filtering

• Enables voice command recognition in factory floors, moving vehicles, and outdoor environments

• Critical for wearable devices and hands-free operation

Audio Amplification

• Class-D amplifier sections for speaker drive

• Efficient power delivery—minimal thermal dissipation even at extended operation

Integration with Motion Sensing

• Voice guidance triggered by motion events (e.g., "Warning: vibration anomaly detected on bearing 3")

• Gesture recognition enabling mute/unmute via wearable motion sensors

Discover more about Epson audio solutions here.

What to Expect on the Ineltek Stand at Embedded World

The shared Ineltek–Epson stand (Hall 3A, Stand 3A-417) features five distinct technology demonstrations showcasing production-ready Epson solutions:

Motion Sensing Performance Benchmark Display

Live accelerometer and gyroscope performance characterisation:

Engineers can observe real-time noise floor measurements, frequency response analysis, and temperature stability testing of the M-A370 and M-G370. Interactive displays show:

• Frequency-domain noise spectrograms comparing M-A370 ultra-low noise performance (0.02 µG/√Hz) to conventional industrial accelerometers (0.5–1.0 µG/√Hz)

• Temperature stability curves demonstrating ±0.1 mG bias repeatability over -30°C to +85°C operating range

• Live GNSS 1PPS synchronisation enabling multi-sensor time correlation at nanosecond resolution

Why Visit: Understand whether ultra-low noise sensing justifies specification cost for your application. Technical data alone obscures the practical signal-to-noise improvement; live demonstrations make performance differences immediately apparent.

Wireless IoT Integration Example

Functioning condition monitoring node combining M-A370 accelerometer + wireless transceiver:

A mounted bearing continuously streams vibration data over Epson wireless modules. The system performs local anomaly detection (envelope analysis, shock pulse identification) and transmits maintenance alerts only when predictive thresholds are exceeded.

Why Visit: Observe seamless integration between precision sensing and wireless communication—engineers can discuss how this model applies to their specific condition monitoring or predictive maintenance requirement.

Display Scaler and Bridge IC Live Demo

Real-time video scaling and protocol conversion:

The GoldenGate Bridge IC performs live LVDS-to-HDMI conversion of a video stream, demonstrating zero-latency protocol translation. Parallel displays show input (720p LVDS) and output (1080p HDMI) side-by-side, illustrating colour accuracy and upscaling quality.

Why Visit: If you're integrating legacy camera systems with modern SoCs, this demo clarifies whether a single bridge IC can solve your interface mismatch or whether custom engineering is unavoidable.

Voice Guidance and Audio Integration

Natural language prompts responding to sensor events:

An industrial condition monitoring system detects vibration anomalies via M-A370 accelerometer, triggers local analysis, and announces maintenance alerts via Epson voice guidance IC. The system demonstrates multilingual support, ambient noise rejection, and integration with motion sensors.

Why Visit: If your system requires operator notification beyond LED indicators or text displays, observe how Epson voice guidance integrates with embedded systems without requiring cloud connectivity or complex speech processing pipelines.

Beyond the Trade Show – From Evaluation to Deployment

Epson offers structured support pathways for engineers evaluating solutions:

Evaluation Kits (1–2 weeks)

• Complete development boards for M-A370, M-G370, and wireless modules

• Pre-configured firmware enabling immediate functional assessment

• Technical support for design-in questions

Feasibility Studies (2–4 weeks)

• Custom application evaluation using your specific environmental conditions

• Noise floor measurement, power consumption analysis, and thermal characterisation

• Whitepaper documenting results and design recommendations

Design Partnerships (3–12 months)

• Full system integration support from concept through production

• Application-specific firmware optimisation

• Qualification assistance (automotive AEC-Q, industrial IEC 61508, medical FDA)

Call to Action – Meet Epson at Embedded World 2026

Option 1: Book a Pre-Scheduled Technical Consultation

Reserve 30 minutes with Epson applications engineers to discuss your specific requirements. Come prepared with use case details (application type, environmental conditions, performance targets, production volumes). Technical consultations prioritise problem-solving over generic product overviews.

Book your meeting: https://www.ineltek.co.uk/contact

Option 2: Request Complimentary Event Attendance

Embedded World draws 35,000 engineers, 1,200 exhibitors, and five halls of technical content. If you cannot attend in person, Ineltek can request complimentary day passes on your behalf (subject to availability).

Request tickets: https://www.ineltek.co.uk/contact

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FAQs - Epson Product Showcase

Q. How do Epson's QMEMS accelerometers compare to conventional silicon MEMS on price and performance?

A: Epson QMEMS delivers 5–10× lower noise density and superior long-term stability, justifying higher unit cost for applications where measurement precision is non-negotiable (seismic monitoring, structural health, precision machinery). For cost-sensitive applications accepting ±1°/h gyro drift or 0.5 µG/√Hz noise floors, conventional silicon MEMS remain appropriate. Epson's value proposition targets applications where recalibration cost, system reliability, or regulatory requirements make precision economics favourable.

Q: Can the M-A370 accelerometer and M-G370 IMU be used together for complete 6-axis inertial measurement?

A: Yes. Epson accelerometer and gyroscope modules are matched in bandwidth, noise characteristics, and temperature stability, enabling seamless sensor fusion. Many engineers combine M-A370 accelerometer with M-G370 gyroscope for custom 6-axis inertial systems optimised to specific application requirements (e.g., emphasis on ultra-low noise for vibration analysis plus gyro for orientation tracking).

Q: What is the typical timeline from evaluation kit to production deployment?

A: 3–6 months for straightforward motion sensing applications; 6–12 months for complex system integration (display scaling plus wireless plus timing synchronisation). Epson feasibility studies (2–4 weeks) accelerate timeline by identifying integration challenges early. Customer-specific firmware optimisation typically adds 4–8 weeks.

Q: Do Epson wireless modules support standard protocols (Zigbee, Thread, Bluetooth) or are they proprietary?

A: Epson offers both standards-based (Zigbee 3.0, Thread, IEEE 802.15.4) and proprietary low-power mesh implementations. Standards-based options simplify interoperability with third-party devices; proprietary stacks optimise range, power consumption, or latency for specific applications. Technical team can advise on protocol selection based on your ecosystem requirements.

Q: How does the GoldenGate Bridge IC maintain video synchronisation during LVDS-to-HDMI conversion?

A: The bridge IC performs deterministic protocol translation with <1 microsecond latency variation, maintaining frame synchronisation and colour fidelity across the conversion. Real-time performance enables live camera feeds without visible artifacts or temporal desynchronisation—critical for automotive safety systems and industrial vision applications.

Q: Are Epson motion sensors suitable for harsh industrial environments (vibration, temperature extremes, moisture)?

A: Yes. Epson accelerometers and IMUs operate across -40°C to +85°C (some models to +100°C). Sealed aluminium and stainless steel packaging provides IP67 protection (dust and water resistant). MTTF specifications (87,600+ hours) support long-term outdoor and industrial deployment. Customer experience includes seismic monitoring stations (exposed to weather), railway infrastructure (vibration and temperature cycling), and oil/gas field monitoring.

Q: What is Epson's approach to long-term product availability and supply chain resilience?

A: Epson maintains 10–15 year product lifecycle for sensor modules, supporting infrastructure and industrial customers with long-term requirements. TSMC and Samsung foundry partnerships ensure manufacturing flexibility. Regional distribution through partners like Ineltek reduces supply chain vulnerability. Critical components include buffer stock management and flexible allocation during demand spikes.