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GUC
GUC supports automotive electronics with advanced packaging technology (APT) designed for high-performance, space-constrained environments. Their expertise in system-in-package (SiP) and multi-die integration enables efficient thermal management, reduced form factor and enhanced signal integrity - critical for next-generation ADAS, infotainment and powertrain control units.
Product Range
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You can explore other component categories for GUC by clicking the corresponding category below:
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E Ink Ripple Waveform and Spectra 6: Breakthrough in Ultra-Low Power Colour ePaper Displays
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Advantech AIMB-523: Ryzen-Powered Motherboard for Edge Computing & Industrial AI
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