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GUC
GUC supports automotive electronics with advanced packaging technology (APT) designed for high-performance, space-constrained environments. Their expertise in system-in-package (SiP) and multi-die integration enables efficient thermal management, reduced form factor and enhanced signal integrity - critical for next-generation ADAS, infotainment and powertrain control units.
Product Range
ASIC IP / Design & Production Services
Advanced Packaging Technology (APT) |
You can explore other component categories for GUC by clicking the corresponding category below:
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How to Improve Thermal Performance in High-Power SiC MOSFET Designs: A Comparison of 1200V and 1700V Solutions
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How to Extend Battery Life in Industrial IoT Devices with Sub-1GHz Wireless
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