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GUC
GUC supports automotive electronics with advanced packaging technology (APT) designed for high-performance, space-constrained environments. Their expertise in system-in-package (SiP) and multi-die integration enables efficient thermal management, reduced form factor and enhanced signal integrity - critical for next-generation ADAS, infotainment and powertrain control units.
Product Range
ASIC IP / Design & Production Services
Advanced Packaging Technology (APT) |
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SIM7070G-HP-S NTN Module for Satellite and Cellular IoT Connectivity
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Automotive‑Grade Battery Monitoring IC For Industrial ESS And UPS: Nuvoton KA849xx BMIC With EIS SOH Estimation
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